Over time, many SMT component packages absorb small amounts of moisture. When these components go through the reflow oven, this moisture may expand, damaging or destroying the component. Sometimes the damage can be seen visually; sometimes it can’t be seen at all.
We bake to drive this damaging moisture out of the components. However, baking your components may delay your job by up to 48 hours. We do not count the bake time toward your turn-time.
We follow the JDEC J-STD-033B.1 standard.
That means, if the component has a moisture sensitive label, or the package is open and without a label, we will either determine if it needs to be baked or call you for a decision.
On 5- and 10-day turn-times, this probably will not cause a delay. On 24- and 48-hour jobs, the need to bake components will cause a delay of up to 48 hours. We will add the extra time for baking to your turn-time.
If possible, always send us your components sealed in their original packaging, just as you have received them.
