FLEX + RIGID HYBRID BOARD

FR4 & POLYIMIDE KAPTON THICK

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FLEXIBLE BOARD

FR4 & POLYIMIDE KAPTON THICK

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BLIND & BURRIED 1+FLEX+1 LASER DRILL

Material: Flex:L2~L3 TU-768:L1~L0 L0~L4 Laser:L4~L0 laser via:0.006″ Dielec tricthickness: 0.0035″~0.0045″ No VIPPO

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CONSTRUCTION MATERIALS

Material Type

• PI thic:1~3mils
• Coverlay thic:2mils
• Ink thic:0.5~0.9mils
• Adhesive thic:1~2mils (Polyester)
• Nonflow PP 47N 49N thic:2.5mils
• Stiffener PI FR4 AL
• Copper ED RA
• EMI SF-PC5500 thic:0.6~0.8mils
• Cu + adhesive thic:2.4mils

Blind vias

• Copper windowing
• Laser via
• Copper plating
• Coverlay/Soldermask
• Fab.: CNC, Laser cutting
• Stiffener

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FLEX MAIN EQUIPMENTS

PRECISION HOT-AIR OVEN	LDI
LASER CUTTING	MASS. LAM. FOR FLEX AND COVER LAY

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MATERIAL ALUMINUM & FLEX BASE

Material : FR4-ISOLA370HR Aluminium flex

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CAPABILITY