Flex and Rigid Flex
FLEX + RIGID HYBRID BOARD
FR4 & POLYIMIDE KAPTON THICK
FLEXIBLE BOARD
FR4 & POLYIMIDE KAPTON THICK
BLIND & BURRIED 1+FLEX+1 LASER DRILL
Material:
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CONSTRUCTION MATERIALS
Material Type
- PI thic:1~3mils
- Coverlay thic:2mils
- Ink thic:0.5~0.9mils
- Adhesive thic:1~2mils (Polyester)
- Nonflow PP 47N 49N thic:2.5mils
- Stiffener PI FR4 AL
- Copper ED RA
- EMI SF-PC5500 thic:0.6~0.8mils
- Cu + adhesive thic:2.4mils
Blind vias
- Copper windowing
- Laser via
- Copper plating
- Coverlay/Soldermask
- Fab.: CNC, Laser cutting
- Stiffener
FLEX MAIN EQUIPMENTS
PRECISION HOT-AIR OVEN | LDI |
LASER CUTTING | MASS. LAM. FOR FLEX AND COVER LAY |
MATERIAL ALUMINUM & FLEX BASE
Material : FR4-ISOLA370HR Aluminium flex |