BGA or Ball Grid Array Rework
Just like any other electronic assembly, BGA assemblies also require occasional rework or modifications. PCB Trace Technologies Inc has extensive experience and technical know-how with BGAs. We can rework your BGA board assembly, while preserving its robust reliability.
Replacing and/or Reworking BGAs
When reworking PCB assemblies, it is necessary to heat the solder connections under the BGA to make them reflow. However, the heating must not damage the board or any other component on it. The only option is to heat the BGA from the top, and allow the heat to travel through the IC to melt the connections under it.
However, doing the above could result in delivering a thermal shock to the PCB. Therefore, the operator must first preheat the board just below the BGA. Once the board reaches preheat temperatures, applying a little more heat from the top is enough to melt the solder balls under the BGA, allowing its safe removal.
To reuse the BGA, it is necessary to re-ball the component. This requires removing the old solder from under the IC, and adding new solder balls to the BGA.
To install the newly balled BGA, the operator places it onto the PCB assembly, and positions it accurately. They preheat the PCB again, and as the PCB reaches the preheat temperature, they apply extra heat to the top of the BGA. This melts the solder allowing it to reflow and form new connections.
After reworking, the operator must clean and inspect the printed circuit board. Only then it is ready to ship to the customer.
For additional information for BGA rework, please call us at 1 408-580-0722 or contact us at [email protected].