HDI Technology in Hole

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High Density Interconnection

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Blind & Burried 9+2+9 Laser Drill

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Market Trend vs. Technology Solution

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HDI Process Flow

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Main Process of Build – up Layer

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Construction Materials

MATERIAL TYPE

• FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
• FR 4 High Tg ( Tg. 160 – 180 ℃ )
• RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
• Ink ( VIL )

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Comparison of Material

	Prepreg	RCC
Low Cost	++	–
Strength	++	+
Hole wall roughness	–	+
Laminating control	+	–
Dielectric thickness	45um ~	30um ~ 80um
Smear residue on target pad	–	++
Dielectric constant	3.9 ~ 4.7	3.2 ~ 3.8
Shelf time	++	+
Working PNL size	++	+

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Comparison of Via Technologies

	Mechanical Drilling	Laser Drilling
Low Cost in Equipment	++	+
Low Cost in Production	+	++
Required Facilities	Drilling Machine	Laser Machine
Consumable	Drill Bits, Backup Board	None
Aspect Ratio	9	1
Via Size Capacity	200 um~	50~100um
Speed	140 H/min	20,000 H/min
Throughput	–	+

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Comparison of Blind Via

PREPREG	RCC

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Build-up for 2 + N + 2

THROUGH HOLE	INNER LASER VIA	STACK HOLE

INNER VIA HOLE	SURFACE LASER VIA

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Laser Via Quality

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1+6+1 without buried, extend to 1+N+1

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1+4+4+1 with buried via, extend to 1+N+N+1

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Black Oxide Treatment

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D.F. Strip

–

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Etching

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D.F. Exposure / Developing

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Dry Film Lamination

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I.V.H.Grinding( for thickness >= 60 mil )

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I.V.H.Grinding( for thickness >= 60 mil )

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Electro Plating

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Electroless Copper Plating

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I.V.H.(Inner Via Hole) Drilling

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I.V.H.(Inner Via Hole) Drilling

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Blind via Capability

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2+4+2 Staggered via, extend to 2+N+2

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2+4+2 laser via on laser via

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Solder Mask Printing

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Dry Film Lamination

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Lamination

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Prepreg Layup

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Black Oxide Treatment

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D.F. Exposure / Developing

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Dry film, Exposure & DES

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Electro Plating

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Desmear / Electroless Copper Plating

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Laser Drilling for Blind Via

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D.F. Strip

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Etching

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D.F. Exposure / Developing

–

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S/M Exposure / Developing

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Surface Finish

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Symbol Mask Printing

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Inspection

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