HDI Capability
HDI Technology in Hole
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability1.png)
High Density Interconnection
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Blind & Burried 9+2+9 Laser Drill
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Market Trend vs. Technology Solution
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability4.png)
HDI Process Flow
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability5.png)
Main Process of Build – up Layer
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability6.png)
Construction Materials
MATERIAL TYPE
- FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
- FR 4 High Tg ( Tg. 160 – 180 ℃ )
- RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
- Ink ( VIL )
Comparison of Material
Prepreg | RCC | |
Low Cost | ++ | – |
Strength | ++ | + |
Hole wall roughness | – | + |
Laminating control | + | – |
Dielectric thickness | 45um ~ | 30um ~ 80um |
Smear residue on target pad | – | ++ |
Dielectric constant | 3.9 ~ 4.7 | 3.2 ~ 3.8 |
Shelf time | ++ | + |
Working PNL size | ++ | + |
Comparison of Via Technologies
Mechanical Drilling | Laser Drilling | |
Low Cost in Equipment | ++ | + |
Low Cost in Production | + | ++ |
Required Facilities | Drilling Machine | Laser Machine |
Consumable | Drill Bits, Backup Board | None |
Aspect Ratio | 9 | 1 |
Via Size Capacity | 200 um~ | 50~100um |
Speed | 140 H/min | 20,000 H/min |
Throughput | – | + |
Comparison of Blind Via
PREPREG | RCC |
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Build-up for 2 + N + 2
THROUGH HOLE | INNER LASER VIA | STACK HOLE |
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INNER VIA HOLE | SURFACE LASER VIA |
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Laser Via Quality
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability12.png)
1+6+1 without buried, extend to 1+N+1
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-13.png)
1+4+4+1 with buried via, extend to 1+N+N+1
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-14.png)
Black Oxide Treatment
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-27.png)
D.F. Strip
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Etching
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-26.png)
D.F. Exposure / Developing
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-25.png)
Dry Film Lamination
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-24.png)
I.V.H.Grinding( for thickness >= 60 mil )
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-23.png)
I.V.H.Grinding( for thickness >= 60 mil )
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-22.png)
Electro Plating
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-21.png)
Electroless Copper Plating
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-20.png)
I.V.H.(Inner Via Hole) Drilling
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-19.png)
I.V.H.(Inner Via Hole) Drilling
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability18.png)
Blind via Capability
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-17.png)
2+4+2 Staggered via, extend to 2+N+2
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-16.png)
2+4+2 laser via on laser via
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-15.png)
Solder Mask Printing
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-40.png)
Dry Film Lamination
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-31.png)
Lamination
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-30.png)
Prepreg Layup
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-29.png)
Black Oxide Treatment
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-28.png)
D.F. Exposure / Developing
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-32.png)
Dry film, Exposure & DES
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-39.png)
Electro Plating
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-38.png)
Desmear / Electroless Copper Plating
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-37.png)
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-44.png)
Laser Drilling for Blind Via
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-36.png)
D.F. Strip
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-34.png)
Etching
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-33.png)
D.F. Exposure / Developing
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S/M Exposure / Developing
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-41.png)
Surface Finish
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-42.png)
Symbol Mask Printing
![](https://e236493c.rocketcdn.me/wp-content/uploads/2020/06/hdi-capability-43.png)
Inspection
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