Manufacturing Capabilities – Technology of PCB Trace | |||
Standard | Advanced | Emerging | |
Layer Count | 2-48 Layers | 2-48 Layers | 50+ Layers |
Laminate Materials | |||
FR4 Tg 140 | Yes | Yes | Yes |
FR4 Tg 170 | Yes | Yes | Yes |
FR4 Tg 180 | Yes | Yes | Yes |
GETEK | Yes | Yes | Yes |
Polyimide | Yes | Yes | Yes |
Rogers RF | Yes | Yes | Yes |
Taconic RF | Yes | Yes | Yes |
Arlon RF | Yes | Yes | Yes |
Duriod | Yes | Yes | Yes |
RoHS Materials | Yes | Yes | Yes |
Halogen Free | Yes | Yes | Yes |
Aluminum Backing | Yes | Yes | Yes |
Brass Backing | Yes | Yes | Yes |
Copper Backing | Yes | Yes | Yes |
Bergquist | Yes | Yes | Yes |
Laird | Yes | Yes | Yes |
C-LEC Plastic | Yes | Yes | Yes |
Speed Board | Yes | Yes | Yes |
Flex Substrates | Yes | Yes | Yes |
Board Types | |||
Rigid | yes | yes | yes |
Rigid-Flex | yes | yes | yes |
Flex | yes | yes | yes |
RF Microwave | yes | yes | yes |
Mix Dielectrics / Hybrid Material | yes | yes | yes |
Dielectrics With Metal Core/Backing | yes | yes | yes |
Panel Sizes | Standard Panel | Non-Standard Panel | |
12 X 18 | Yes | No | |
16 X 18 | Yes | No | |
16 x 21 | No | Yes | |
18 X 24 | Yes | No | |
21 x 24 | No | Yes | |
22 x 28 | No | Yes | |
47″ x 47″ (maximum working panel 2 layers) | No | Yes | |
39″ x 39″ (maximum working panel 4-8 layers) | No | Yes | |
27″ x 27″ (maximum working panel 10 layers) | No | Yes | |
** Panel Utilization Can Vary On Panel Area Depending On Design, IPC Coupons & TDR Coupons. | |||
Board Types | |||
Finish Thickness | .003″ to .200″ | .003″ to .500″ | > .500 |
Minimum Core Thickness | .004″ | .003″ | .002″ |
Finished Thickness Tolerance | 10% | 7% | 5% |
Multiple Lamination Cycles | 5 | 7 | 7+ |
Copper Foil Weights (Internal Layers) | 1/2 – 3 OZ | 1/4 – 4 OZ | 1/4 – 6 OZ |
Copper Foil Weights (External Layers) | 1/2 – 3 OZ | 1/4 – 4 OZ | 1/4 – 6 OZ |
Pad, Lines & Spacing Diameters | |||
External Line Width | .004″ | .003″ | .002″ |
External Spacing | .004″ | .003″ | .002″ |
Internal Line Width | .004″ | .003″ | .002″ |
Internal Spacing | .004″ | .003″ | .002″ |
External Pad Size – Annual Ring Per Side | .005″ | .004″ | .003″ |
Internal Pad Size – Annular Ring Per Side | .005″ | .004″ | .003″ |
SMT Pitch | .040″ | .030″ | .020″ |
BGA Pitch | .040″ | .030″ | .020″ |
Impedance | 10% | 5% | 2.50% |
Plating Finishes | |||
ENIG (Electroless Nickel Immersion Gold) | Yes | Yes | Yes |
Immersion Silver | Yes | Yes | Yes |
Immersion White Tin | Yes | Yes | Yes |
HASL (60/40 Tin-Lead) | Yes | Yes | Yes |
HAL (Lead-Free) | Yes | Yes | Yes |
Nickel (Electroplated) | Yes | Yes | Yes |
Palladium (Electroplated) | Yes | Yes | Yes |
Gold (Electroplated) | Yes | Yes | Yes |
Soft Wire Bondable Gold | Yes | Yes | Yes |
OSP (Organic Surface Protection) | Yes | Yes | Yes |
Carbon Ink | Yes | Yes | Yes |
Selective Plating | Yes | Yes | Yes |
RoHS Finishes | |||
ENIG (Electroless Nickel Immersion Gold) | Yes | Yes | Yes |
Immersion Silver | Yes | Yes | Yes |
Immersion White Tin | Yes | Yes | Yes |
HAL (Lead-Free) | Yes | Yes | Yes |
OSP (Organic Surface Protection) | Yes | Yes | Yes |
Soft Wire Bondable Gold | Yes | Yes | Yes |
Tolerances | |||
Hole Aspect Ratio | 10:01 | 15:01 | 20:01 |
Drilled Hole To Copper | .008″ | .005″ | < .005″ |
Plated Hole Tolerances (+/-) | .003″ | .002″ | <.002″ |
Non Plated Hole Tolerances (+/-) | .001″ | .001″ | .001″ |
Fabrication Tolerances (+/-) | .005″ | .003″ | <.003″ |
Board thickness Tolerance(+/-) | 10% | ||
Via Holes | |||
Laser Micro Vias | 0.004 * | 0.003 * | 0.002 * |
Blind Vias | .0063″ | .0063″ | .0063″ |
Buried Vias | .0063″ | .0063″ | .0063″ |
Via Holes Under PAD | Yes | Yes | Yes |
Laser Drill | Pending | Pending | Pending |
Mechanical Drill Vias | .0063″ | .0063″ | .0063″ |
Tented Vias | Coated with LPI | Coated/Plugged | Coated/Plugged |
Silver Conductive Via Filled | Yes | Yes | Yes |
Copper Conductive Via Filled | Yes | Yes | Yes |
Non-Conductive Via Filled | Yes | Yes | Yes |
Copper Plated Plugged Vias (80%) .008″ Min | Yes | Yes | Yes |
Automated Planarization Capability | Yes | Yes | Yes |
Routing/Scoring | |||
Scoring (Jump) | Yes | Yes | Yes |
Scoring (Jump) Min length 1″ | Yes | Yes | Yes |
Scoring Webb .014 +/- .003 Min | Yes | Yes | Yes |
Routed/Plated Edges | Yes | Yes | Yes |
Routed/Plated Pockets & Cuts Outs | Yes | Yes | Yes |
Z-Depth Routing (Plated Pockets & Cutouts) | Yes | Yes | Yes |
Cavities (Plated & Non-Plated) | Yes | Yes | Yes |
Soldermask | |||
LPI (Liquid Photo Imagable Soldermask) | Yes | Yes | Yes |
Soldermask Colors | All Avail. Colors | All Avail.Colors | All Avail.Colors |
Soldermask Type | LPI | LPI | LPI |
Dry Film Soldermask | Yes | Yes | Yes |
Minimum Mask Clearance (LPI) Per Side | .003″ | .002″ | .001″ |
Minimum Mask Clearance (Dry Film) | .003″ | .003″ | .003″ |
Minimum Soldermask Thickness (LPI) | .0005″ | .0004″ | .0004″ |
Minimum Soldermask Thickness (Dry Film) | .003″ | .003″ | .003″ |
Soldermask Web Minimum (LPI) | .004″ | .003″ | .003″ |
Soldermask Web Minimum (Dry Film) | .010″ | .008″ | .008″ |
Silkscreen/Legend | |||
Silkscreen/Legend Colors | All Avail. Colors | All Avail. Colors | All Avail. Colors |
Silkscreen/Legend Feature Size | .008″ W X .030 H Min. | .008″ W X .030 H Min. | .008″ W X .030 H Min. |
Flatness | IPS Standard | IPC Standard | IPC Standard |
Electrical Testing | |||
Netlist Testing | Yes | Yes | Yes |
Flying Probe | Yes | Yes | Yes |
Clamshell Fixture | Yes | Yes | Yes |
Netlist IPC-356A | Yes | Yes | Yes |
Controlled Impedance | |||
Controlled Impedance Testing | Yes | Yes | Yes |
TDR Tester (Polar Instruments) | Yes | Yes | Yes |
Impedance tolerance (+/-) | 10% | 5% | 2.50% |
CAM | |||
Genesis 2000 | Yes | Yes | Yes |
ODB++ | Yes | Yes | Yes |
FTP Site | Yes | Yes | Yes |
Certifications & Standards | |||
AS9100 Certified | Yes | Yes | Yes |
ISO 9001:2008 Certified | Yes | Yes | Yes |
MIL-PRF-31032 Certified | Pending late 2011 | Pending late 2011 | Pendind late 2011 |
ITAR Registered | Yes | Yes | Yes |
IPC Standards | Yes | Yes | Yes |
IPC-6012 Class 1,2,& 3 | Yes | Yes | Yes |
IPC-6013 Class 1,2,& 3 | Yes | Yes | Yes |
IPC-6018 Class 1,2 & 3 | Yes | Yes | Yes |
MIL-PRF-55110 Certified FR4/GFN | Yes | Yes | Yes |
MIL-PRF-55110 Certified Polyimide/GIN | Yes | Yes | Yes |
Certified Etchback On Mil-PRF-55110 | Yes | Yes | Yes |