Terms & Conditions

Terms & Conditions

Documentation Requirements for PCB fabrication

 In order to properly process your order, we request that you submit a complete documentation package. This includes: 

  • Complete manufacturing specifications, both board-specific and any master specifications 
  • If the boards are to be delivered in sub-arrays, a complete, dimensioned array drawing 
  • Gerber data that includes all layers to be fabricated and a drill file. PCB Trace Technologies Inc prefers ODB++ or Gerber 274-X 
  • IPC-356A Netlist file 

  • If customer provides both (Gerbers and ODB++) it is customer’s responsibility to ensure that the design in both formats are the same.  It is not PCB Trace Technologies Inc responsibility.
  • All boards fabricated in our online tool will all be considered and build per IPC-6012 Class 2 specs.
  • After shipment of PCBs, you have 30 days to return for any errors due to manufacturing, workmanship or non-conforming to fab print.

While these documentation/files are not absolutely necessary to proceed with fabrication, missing information may cause data interpretation issues or may delay the production of your boards or price may be changed, resulting in manufacturing errors or production delays. We will not be held responsible for any delays or product failures due to missing or incomplete data or documentation.

Documentation Requirements for Parts and Assembly

In order to properly process your order, we request that you submit a complete documentation package. This includes:

  • Detailed BOM (Build of Material) with Ref. Designator, Quantity per board, Manufacturing part number, Part description, DNI (do not install) parts etc..
  • Detailed Assembly Drawing with polarity marking, Paste files in Gerber format (PCB Trace Technologies Inc prefers ODB++ or CAD data or Gerber 274x), Panelized Gerber if boards are in array format, Pick & place file, special instruction if any.
  • If customer provides both (Gerbers and ODB++) it is customer’s responsibility to ensure that the design in both formats are the same.  It is not PCB Trace Technologies Inc responsibility.
  • Parts prices are subject to change based on availability with suppliers and current market pricing at the time of order placement.
  • For all Turnkey orders, it is our company policy to partially pre-charge minimum 50% of your order at the time of parts procurement so all parts could be ordered from vendors accordingly and remaining balance to be covered at the time of shipment.
  • For all Parts only orders, we will charge 100% of your order at the time parts procurement so all parts could be ordered from vendors accordingly.

Lead Time: 

  • PCB Fabrication lead times will begin after all engineering questions have been cleared.
  • Parts Lead time and price might be changed based on availability with suppliers.
  • Assembly lead times will begin after all parts have been audited and shortages have been cleared.

Price / Payment: 

  • PCB fabrication cost might be changed at the time of order if customer not provided detailed information at the time quoting.
  • Parts cost might be changed at the time of order based on the supplier.
  • PCB Assembly cost might be changed if customer not provided detailed information at the time of quoting.
  • Parts prices are subject to change based on availability with suppliers and current market pricing at the time of order placement.
  • For all Turnkey orders, it is our company policy to partially pre-charge minimum 50% of your order at the time of parts procurement so all parts could be ordered from vendors accordingly and remaining balance to be covered at the time of shipment.
  • For all Parts only orders, we will charge 100% of your order at the time starting of parts procurement so all parts could be ordered from vendors accordingly.

FAB DFM & ASSEMBLY DFA:

All orders are required to go thru Design for Manufacturing (DFM) and Design for Assembly (DFA) checks, to avoid any delays during manufacturing and assembly. Our PCB fabrication and PCBA Teams will be in constant touch simultaneously to resolve all queries ASAP.
Fab manufacturing will only begin once all DFM queries are cleared and resolved.  

Assembly processes will only begin once all DFM queries are cleared and audit is cleared.

ONLINE PCB / ONLINE TURNKEY PRICES:

Online prices and instant quotes do not include the following:

  • Installation of PEM nuts, Press-Fit connectors, Rivets or Turrets Terminal.
  • Specific processes: Edge bond, underfills, Wire-Bonding, staking, jumper wires, Conformal Coating.
  • Special placement or Rework of caps or resistor which requires manual configuration placement , trace cuts, manually adding wire jumpers or wires onto the boards.

If we find any of these special instructions, your order will be put on hold and our sales team will follow up with revise cost and additional labor time for your approval. 

ASSEMBLY WORKMANSHIP AND WARRANTY GUIDELINES:

  • After shipment of each assembly, you have 30 days to return for any workmanship errors or non-conforming to assembly print.  We will repair / rework at our cost.
  • All Assemblies are assembled per IPC-A-610 Class 2.
  • All assemblies are assembled per customer’s design, BOM and gerbers.  We will not be held responsible if the assembled PCBA doesn’t performs or functions due to customer’s design, parts or consigned PCBs provided by customer.
  • It is customer’s responsibility for rework, repair or replacement if the consigned parts are found to be bad or for parts which are purchased by us based on customer’s BOM and given supplier choices.
  • It is customer’s responsibility to troubleshoot the boards if they are finding them to be as non-functioning at the time of their boot up test or functional testing.  PCB Trace Technologies Inc only takes responsibility for the assembly labor and workmanship.
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Increased Production Panel Output

We can now ship 100 production panels of 18"x24" in 5-7 working days for 2 to 10 layer designs.

Certifications

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PCB Trace Technologies Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.