Category: PCB

How a Heat Sink PCB Works

Regular printed circuit boards have a limited capacity for dissipating the heat that a hot component is generating when in operation. This is because the board typically has only thin and narrow copper tracks. Even when there are regions with large copper lands on the top surface, the mass of copper is not adequate to […]

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Six Popular Copper Clad Laminates

According to PCB Trace Technologies Inc, each Printed Circuit Board or PCB has its own requirements and specifications. Their usage conditions guide product development engineers in selecting the best options for PCBs. The PCB industry divides copper clad laminates into various categories, such as: Mechanical Rigidity—There are rigid copper clad laminates and flexible copper clad […]

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Avoiding Fractured Traces in Flexible Circuit Boards

Although some customers believe otherwise, PCB Trace suggests that flex circuits are not indestructible. As with any product containing a metal part that is handled or bent beyond its mechanical capabilities, it is likely to break. Primarily, there are three main causes that lead to fractures or cracks in flex circuits, and we will review […]

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All About ENIG and ENEPIG PCB Surface Finishes

PCB Trace Technologies Inc makes PCB surface finishes in different types. This is a crucial aspect in PCB manufacturing, as it prevents the exposed copper from becoming oxidized. Surface finish is crucial, as it enables a proper connection between the copper pad and the component over it. Apart from complying with some standard in the […]

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All About OSP Surface Finish

PCB Trace Technologies Inc offers many types of surface finishes for the PCBs we manufacture. These include HASL or Hot Air Solder Leveling, ENIG or Electroless Nickel Immersion Gold, OSP or Organic Solderability Preservative, ENEPIG or Electroless Nickel Electroless Palladium Immersion Gold, Immersion Tin, and Immersion Silver. Conductivity of the surface on the copper pad […]

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Certifications

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PCB Trace Technologies Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.