Category: PCB

All About ELIC PCB Manufacturing

IPC-2226 standards have many standard PCB stackups under them that support HDI PCB routing. These allow routing traces for fine-pitch components like BGA. Most standard HDI PCB stackups use buried and through-hole vias that pass through all layers. They may also use blind/buried microvias along with skip-vias on their surface layers. This allows BGA breakouts […]

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Understanding HDI Stackups

HDI or High-Density Interconnect technology has brought about a revolution in the PCB or Printed Circuit Board industry. It allows designers to create highly complex boards in smaller sizes but with improved performance. With the form factor of electronic devices reducing continuously, and greater functionality expected out of them, the significance of HDI PCBs is […]

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Optimum Via Size For Your PCBs

PCBs or Printed Circuit Boards use various types of vias—through types, tented vias, blind vias, buried vias, stacked vias, staggered vias, and via in pad. Most designers know that the via type they use affects its size. In this article, PCB Trace Technologies Inc. discusses the restrictions typically present on PCB via size and the […]

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All About Irregularly Shaped PCBs

Most PCB designers have designed their boards in mostly rectangular or square shapes. However, when the enclosure is in an irregular shape, they have two choices—to continue with a rectangular/square shape that is considerably smaller than the enclosure or to design irregularly shaped PCBs that closely match the enclosure shape. In the first case, the […]

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Challenges of LED PCBs Design

PCBs or Printed Circuit Boards for LEDs or light-emitting diodes are different from other circuit board designs, as the boards must help dissipate the excess heat generated by the LEDs when they are in operation. Although LED PCBs are the foundation of LED lighting systems, one of the core problems in LED PCB design is […]

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PCB Trace Technologies Inc. specializes in higher layer count PCBs, exotic materials, laser drill micro-vias, blind/buried vias, as well as conductive and non-conductive via fill.